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ADE7880
ABSOLUTE MAXIMUM RATINGS
T A = 25°C, unless otherwise noted.
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
Table 5.
Parameter 1
VDD to AGND
VDD to DGND
Analog Input Voltage to AGND, IAP, IAN,
IBP, IBN, ICP, ICN, VAP, VBP, VCP, VN
Analog Input Voltage to INP and INN
Reference Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
Operating Temperature
Rating
?0.3 V to +3.7 V
?0.3 V to +3.7 V
?2 V to +2 V
?2 V to +2 V
?0.3 V to VDD + 0.3 V
?0.3 V to VDD + 0.3 V
?0.3 V to VDD + 0.3 V
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ JA is specified equal to 29.3°C/W; θ JC is specified equal to
1.8°C/W.
Industrial Range
Storage Temperature Range
Junction Temperature
Lead Temperature (Soldering, 10 sec)
?40°C to +85°C
?65°C to +150°C
150°C
300°C
Table 6. Thermal Resistance
Package Type
40-Lead LFCSP
θ JA
29.3
θ JC
1.8
Unit
°C/W
1
Regarding the temperature profile used in soldering RoHS Compliant Parts,
Analog Devices, Inc. advises that reflow profiles should conform to J-STD 20
ESD CAUTION
from JEDEC. Refer to JEDEC website for the latest revision.
Rev. A | Page 10 of 104
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